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| Datasheet File OCR Text: |
| ZMD-Standard June 2004 Package PLCC32 MDS 772 Dimensions in millimetres Based on JEDEC MS-016 variant AE 1 Dimensions A2 e e1 0,2 M bp 0,1 32 e2 k D HD Dimensions of Sub-Group B1 Amax bPmin bPmax enom HDmin HDmax HEmin HEmax 2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form 7 Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Check: signed Marx Date: 9. June 2004 Quality: signed Tina Kochan 1.2 g Low Stress Epoxy Cu-Alloy solder plating J-bends 3.56 0.33 0.53 1.27 14.85 15.12 12.31 12.58 Dimensions of Sub-Group C1 Amin A2min A2max Dmin* Dmax* Emin* Emax* kmin e1min e1max e2min e2max *without mold-flash 3.17 2.69 2.85 13.94 14.05 11.40 11.51 1.00 45 12.44 13.48 9.90 10.94 Doc-No. QS-000772-HD-01 HE E 1 A |
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